Intel introduces new breakthroughs in chip design, vertical stacking

During the Architecture Day event, Intel revealed information about finding a way to build vertical 3D CPUs with more advanced features than before.

Specifically, Intel used a new chip manufacturing technology called "Foveros 3D" to separate parts of a CPU such as graphics, on-die memory, power stabilizers, AI processing, . smaller independent chiplet parts and stacked on top of each other. In this way, Intel was able to build new chips on the 10 nm process from chiplets that could be manufactured on 14 or 22nm processes.

Intel's new vertical 3D CPUs have higher processing speeds, more compact shapes. They can even overcome the physical limits of previous chips, opening up a new future for the CPU.

In addition, at this event, Intel also introduced its new microarchitecture called Sunny Cove - the heart of the Core and Xeon generations, smarter, enhanced security, and improved single-threaded performance. Multi-threaded, and especially towards AI tasks, Machine Learning.

The expected, Intel will launch Sunny Cove in the second half of next year.

As for graphics, Intel also announced Gen11 - the first integrated graphics chip that delivers over 1 TFLOPS performance, promising to deliver even more powerful gaming, encoding and video decoding capabilities.

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