Package-on-Package technology: Reduce cellphone size

The new memory chip technology is particularly useful in keeping the 'small' size of high-end mobile phones.

Meeting the demand for smaller mobile phones, on September 13, 2006 STMicroelectronics announced a new type of memory chip technology.

Package-on-Package technology allows certain components to be assembled in vertical stacks, saving space for mobile phone manufacturers. Technology is especially useful when building high-end mobile phones with sets

High-density memory, allowing manufacturers to coordinate components in a flexible way, STMicroelectronics said. Many components can use Package-on-Package configuration such as NOR Flash and NAND Flash memory.

Today's mobile phones support many functions such as recording / watching videos, cameras, downloading music. These capabilities require a lot of memory, a powerful processor and need more components, thus often increasing the device size. Cell phone manufacturers are often willing to adopt technologies that can help them minimize the size of their final product.