New generation Ultrabooks can be slimmer, lighter and more durable. (Photo: Notebookcheck).
With a large screen, fast boot and ultra-slim design, ultrabook is now widely regarded as a good but expensive choice. To overcome the price weakness, Intel has come up with some specific solutions to reduce costs for this product.
Its R&D department in Washington (USA) has collaborated with Boeing to create the most durable notebook models, from plastic materials to metals. According to Notebookcheck , by using design in aircraft manufacturing, new ultrabook models not only become light and thin but also reduce the price from 25-75 USD.
In addition, the world's largest chip manufacturer is also researching the production of hard drives, motherboards and other computer components by this method to reinforce ultrabook. Each of these components not only makes the computer more durable, but also helps the processor to dissipate heat with higher performance.
the processor manufacturer offers many suggestions for manufacturers to increase the thinness of the device from components such as hard drives, keyboards or new screen panels.
by late ces 2012, dell's world-famous computer company dell has brought the xps 13 ultrabook model with elegant design, backlit keyboard and intel core i-series processor.
on may 31, 2011, intel announced plans for a new ultra-thin and lightweight laptop model at computex 2011. this is intel's latest move to improve its competitiveness in the mobile computer market.
at the taiwan public booth, the s56 ultrabook model was introduced in june at computex 2012. it is known that the device will be on the shelf with two versions, intel gma 4000 (s56ca) or nvidia geforce gt 635m (s56cm), both of which have built-in dvd burners.
when amd announced that it planned in 2012, it was speculated that amd would participate in manufacturing chips for phones and tablets. however, the latest information shows that amd is looking to enter the ultra-thin laptop market like intel does with ultrabook.