Qualcomm's New SoC for Wireless Headsets Has Built-in Active

The first and perhaps most notable of these is the presence of active noise cancellation (ANC) technology right on the chipset, which significantly reduces external noise while you use the headset. ANC is becoming a trend on high-end headphones today. Products equipped with this feature are often quite expensive because manufacturers have to build their own ANC solution. However, two new Qualcomm chips have built-in support for this feature, making it easier to produce a true ANC true wireless headset, the price is also better. significantly.

Another major improvement in these two chips is what Qualcomm calls TrueWireless Mirroring. The method of true wireless headphones is quite simple, one side of the headset (usually the right ear) will be connected to the music source (phone, laptop, music player) to receive information, while the ear The other ear (usually the left ear) connects to the other to receive the signal simultaneously. However, this can make Bluetooth connectivity less stable in some situations.

With the TrueWless Mirroring feature, Qualcomm says both sides of the headset will be directly connected to the source, and can also automatically seamlessly switch between one of the two sides of the headset for a stable connection. Best. In addition, this feature is also very useful in case you just want to use one earphone.

The final highlight is the ability to support multi-platform virtual assistant integrated on both chips, allowing users to use any voice assistant they want without any intervention. Any custom card.

New SoC models from Qualcomm are expected to appear on many true wireless earphones this year.