Outperforming Surface Neo, the Galaxy Book S becomes the world's first Lakefield processor-based laptop

In the framework of the 2019 Samsung Developer Conference (SDC19) in San Jose, USA, the giant of Kim Chi has officially revealed information about the new 2-in-1 Galaxy Book laptop series with many upgrades that are especially noticeable.

This product line includes three devices: Galaxy Book S, Galaxy Book Flex and Galaxy Book Ion. While Flex and Ion devices use the 10th generation Intel processor, Galaxy Book S will be equipped with Intel's latest Intel Lakefield chip - one of the CPU series that is receiving the top interest. at now.

Outperforming Surface Neo, the Galaxy Book S becomes the world's first Lakefield processor-based laptop Picture 1

It is known that Microsoft also plans to equip this processor for the upcoming Surface Neo device in the near future. However, with the appearance of the Galaxy Book S, Samsung proved to be faster than its competitor when it was one step ahead and at the same time gained a significant competitive advantage.

Previously, Lakefield was known to be Intel's own chip for Microsoft based on a specific request from the US giant, but it seems that Samsung is also very interested in this processor, and the they get Lakefield on their products even before Microsoft is truly a "victory" that surprises many.

For its part, Intel also specifically mentioned that the Samsung Galaxy Book S will almost certainly be the first device to use Lakefield on the market that will support LTE connectivity. Hopefully Microsoft will also release Surface Neo with support for this preeminent connection standard.

Lakefield is Intel's latest 'hybrid' mobile processor, with the combination of Intel Foveros 3D technology, allowing OEMs like Microsoft or Samsung to easily place this chip in thin and light designs. , while ensuring stable performance.

Outperforming Surface Neo, the Galaxy Book S becomes the world's first Lakefield processor-based laptop Picture 2

At the same time, this processor is also manufactured using the latest 10nm process and advanced Foveros technology, which significantly reduces standby capacity, core area (12x12x1 mm) and dimensions when compared to generations. Old CPUs use previous technology.

The reason Lakefield is called a 'hybrid' processor is because of the architectural combination between the 'Tremont' core and the 'Sunny Cove' core, which provides computational performance and flexible graphics processing capabilities to optimize. battery life.