as planned, intel's 10nm cannon lake chip will be postponed until 2019, but this year's version will have improvements on the current 14nm process, resulting in more cores and faster clock speeds.
ibm has just released relatively detailed information about its next-generation telum chipset, which is part of the new z series of processors. the telum chip carries a completely new core architecture design, aimed at radically enhancing ai processing capabilities.
the next generation of bluetooth has just been announced, the name used will be bluetooth 4.2. this is seen as an upgrade of security, battery saving and speed of data transfer.
an upgrade to apple's ultraportable computer model only adds a higher-speed processor chip and the retina screen version is expected to be released by the end of 2014.
according to technology website digitimes, ultra-thin ultrabook computers of the 3rd generation will be released next year and will have a touch screen and the ability to display 3d images (3d
this week, intel announced the second generation atom, acer introduced netbooks and nettops on the nvidia ion platform, hewlett-packard shipped pavilion dv2 using amd neo chipsets.
sony unveiled the next generation of vaio fit touchscreen laptops in its product launch event at ifa show last night despite the previous generation of this product just launched in the first quarter of this year.
in the technology age, users are increasingly demanding faster connection speeds. according to the development roadmap, the next generation of wifi standard may reach speeds of up to 10 gbps.